本書系統(tǒng)、全面地闡述了微弧氧化涂層技術的發(fā)展歷史、技術機理、工藝與特性、功能涂層設計、生產線裝備及工程應用，是全面論述微弧氧化涂層的實用技術著作。全書共15章，涉及該領域近年來的主要研究熱點，包括微弧氧化涂層技術概論、微弧氧化過程機理、工藝參數(shù)與制度優(yōu)化、微弧氧化涂層基本特征、抗磨減摩涂層設計與應用、抗腐蝕涂層設計與應用、熱防護涂層設計與應用、熱控涂層設計與應用、介電絕緣涂層設計與應用、催化涂層設計與應用、生物醫(yī)用涂層設計與應用、新涂層與新工藝探索設計與應用、生產線工藝裝備與檢測方法、微弧氧化工藝技術百問等。書中全面、系統(tǒng)地介紹了微弧氧化涂層技術領域當前具有價值的研究成果，代表了微弧氧化涂層技術的發(fā)展水平。
書中內容對于推廣微弧氧化涂層技術的研究成果，推動我國微弧氧化表面工程的發(fā)展，尤其是對于提升我國航空航天、船舶艦船、汽車工業(yè)等高端裝備零部件的功能化性能和使用壽命，都具有非常重要的意義。
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主持國家自然科學青年及面上基金4項，主持教育部新世紀、中國博士后特別資助、哈工大基礎研究杰出人才培育計劃等基金項目5項.參與國家自然科學基金創(chuàng)新群體(負責人周玉院士）、重點項目和企業(yè)合作等各類科研課題10余項。國家發(fā)明專利21項(已授權13項).
目 錄
序
前言
第 1 章 微弧氧化技術概論 ·············································································· 1
1.1 微弧氧化技術簡介 ············································································· 1
1.1.1 微弧氧化技術定義 ········································································· 1
1.1.2 微弧氧化技術特點 ········································································· 1
1.1.3 微弧氧化與陽極氧化對比 ································································ 2
1.2 微弧氧化技術的產生與發(fā)展 ······························································· 3
1.3 微弧氧化技術的應用·········································································· 5
1.4 微弧氧化技術面臨的挑戰(zhàn)與未來發(fā)展方向 ·········································· 6
1.4.1 面臨的挑戰(zhàn) ·················································································· 6
1.4.2 未來發(fā)展方向 ··············································································· 8
參考文獻 ··································································································· 8
第 2 章 微弧氧化涂層形成過程與機理··························································· 10
2.1 概述 ································································································ 10
2.2 微弧氧化涂層生長過程與機理模型··················································· 10
2.2.1 微弧氧化生長過程 ······································································· 12
2.2.2 涂層生長規(guī)律和等離子體放電模型 ·················································· 13
2.2.3 涂層的組織結構形成與特點 ··························································· 15
2.2.4 擊穿-反應-熔凝效應與涂層形成機制模型 ·········································· 19
2.3 微弧氧化涂層生長過程中的陰極放電 ··············································· 22
2.4 微弧氧化涂層生長過程中的氣體演化 ··············································· 23
2.4.1 電解液與電參數(shù)對氣體演化的影響 ·················································· 24
2.4.2 氫氣釋放對涂層生長的影響 ··························································· 25
2.5 微弧氧化涂層生長過程中的能量損耗與控制····································· 25
2.6 本章小結與未來發(fā)展方向································································· 26
參考文獻 ································································································· 26· vi· 微弧氧化原理與功能涂層設計及應用
第 3 章 微弧氧化涂層基本特征 ····································································· 28
3.1 概述 ································································································ 28
3.2 涂層多微孔性與微孔可控性 ····························································· 28
3.2.1 涂層多微孔性 ············································································· 28
3.2.2 微孔結構特征 ············································································· 30
3.2.3 涂層微孔可控性 ·········································································· 30
3.3 涂層的高硬度/高彈性模量 ································································ 31
3.3.1 維氏硬度 ··················································································· 31
3.3.2 納米硬度與彈性模量 ···································································· 33
3.4 涂層膜基界面高的結合強度 ····························································· 35
3.5 涂層內的壓應力特性········································································ 36
3.6 涂層界面“過生長”特性及對力學衰減的影響 ····································· 37
3.7 涂層界面拉應力特性誘導疲勞壽命衰減及改進措施 ·························· 39
3.8 本章小結與未來發(fā)展方向································································· 41
第 4 章 工藝參數(shù)與涂層優(yōu)化策略·································································· 42
4.1 概述 ································································································ 42
4.2 電源輸出模式與涂層優(yōu)化································································· 42
4.3 微弧氧化放電過程控制與涂層優(yōu)化··················································· 46
4.4 電參數(shù)調控制度與涂層優(yōu)化 ····························································· 46
4.5 “軟火花”放電制度與涂層優(yōu)化 ·························································· 49
4.5.1 脈沖頻率對陰極放電的影響與涂層優(yōu)化 ············································ 49
4.5.2 “軟火花”放電條件形成與涂層優(yōu)化··················································· 51
4.6 電解液影響與涂層優(yōu)化 ···································································· 52
4.6.1 電解液的作用及分類 ···································································· 52
4.6.2 基礎電解液體系與涂層優(yōu)化 ··························································· 54
4.6.3 特殊離子/粒子添加的電解液體系與涂層優(yōu)化 ····································· 56
4.6.4 自封孔涂層的電解液體系與涂層優(yōu)化 ··············································· 59
4.6.5 非水電解液體系與涂層優(yōu)化 ··························································· 61
4.7 金屬成分影響與涂層優(yōu)化································································· 63
4.7.1 金屬發(fā)生微弧氧化反應難易程度與熱力學解釋 ··································· 63
4.7.2 金屬合金成分對涂層生長的影響 ····················································· 64
4.7.3 不同冶金狀態(tài)的基體對涂層生長的影響 ············································ 68目 錄 · vii·
4.7.4 金屬基復合材料對涂層生長的影響 ·················································· 69
4.7.5 高熵合金對涂層生長的影響 ··························································· 71
4.8 本章小結與未來發(fā)展
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